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 Features |
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- High-concentration ink with 40~90% silver content |
| - Easy control of print thickness |
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| Low-temperature properties |
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- Low-temperature baking below 120¡É |
| - Baking within a minute |
| - PET films low in thermal stability can be applied. |
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- Non-resistance : 3~5x10-6§Ù§¯
(Varies depending on baking condition and substrate) |
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- Paper, PET, PI and glass can be applied |
| - Development of suitable formulae for different substrates |
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| Images of TEM |
| Average particle size : 40nm |
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| Electrical Properties |
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| Features |
Unit |
Outcome |
| Baking thickness |
§ |
1.3 |
| Surface resistance |
§Ù |
3.1x10-2 |
| Specific resistance |
§Ù§¯ |
3.9x10-6 |
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| Non-Resistance Properties |
| * Baking Temperature Effects: According to the baking time and temperature 2.5~5 *10-6§Ù§¯ |
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| Cross-section after baking |
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| Examples of RFID Applications |
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| Image of SEM |
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| Method |
NPK Nano ink |
General paste ink |
| Cross section |
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| Plane figure |
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| Performance Overview |
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| Method |
Copper etching |
Silver-paste printing
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NPK silver-nano printing |
| Thickness (§) |
10.0 |
5.7 |
1.5 |
| Surface resistance (m¥Ø /¤±) |
1.7 |
130 |
21.9 |
| Specific resistance (¥ì¥Ø§¯) |
1.7 |
74.1 |
3.3 |
| Specific resistance (MHz) |
906 |
898 |
902 |
| Antenna efficiency (%) |
82 |
44 |
74 |
| Effective distance ratio (%) |
100 |
73 |
95 |
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| ¢Ñ These values may be changed by the antenna design and/or thickness |
